Christoph Lehmann

Projekt

Gallisense - Giving materials the passive ability to sense
Wenn ein Material sich seiner Umgebung bewusst sein soll, muss es in der Lage sein, Informationen über seinen physikalisch-mechanischen Zustand abzufragen. Ziel meiner Forschung ist es, einen robusten und skalierbaren Sensoransatz zu entwickeln, der dem Material ein Selbstbewusstsein verleiht, d.h. eine Zustandsmeldung und ein Zustandswechsel. Dies erreichen wir, indem wir innovative Sensormethoden entwickeln, die die leitfähigen Eigenschaften von Galliumtröpfchen nutzen.

Erstbetreuer

Prof. Dr. Peter Woias

Zweitbetreuerin

Dr.-Ing. Laura Maria Comella

Publikationen in livMatS

• A Miniaturised Device with Programmable Excitation Signal for the Inductive Coupling with LC Circuits and Sensors
  Lehmann, C., Winnerman Agbozo, S., Woias, P., & Comella, L. (2026). A Miniaturised Device with Programmable Excitation Signal for the Inductive Coupling with LC Circuits and Sensors. Chips, 2026, 5(2), 16. doi: 10.3390/chips5020016
• Soft Mechanical-Electrical Logic Using Liquid Metal-Filled 3D-Printed Architectures*
  Lehmann, C., Kalgreen, R., & Comella, L. M. (2026). Soft Mechanical-Electrical Logic Using Liquid Metal-Filled 3D-Printed Architectures. Advanced Engineering Materials, 0, e202600014, doi: 10.1002/adem.202600014.
• Pressure sensing and its wireless readout enabled by controlled liquid metal manipulation*
  Lehmann, C., Winnerman Agbozo, S., & Comella, L. M. (2026). Pressure sensing and its wireless readout enabled by controlled liquid metal manipulation. Sensors and Actuators A: Physical, Vol. 408, 117982, doi: 10.1016/j.sna.2026.117982.
• A Pressure-Driven Microfluidic Electrical Switch Array Embedded in a Flexible Matrix*
  Lehmann, C., Usama. A., Hou, P., Rapp, B.E., & Comella, L. M. (2025). A Pressure-Driven Microfluidic Electrical Switch Array Embedded in a Flexible Matrix. IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Singapore, pp. 1-4, doi: 10.1109/FLEPS65444.2025.11105621.
• Surface roughness in microfluidic device fabrication: limitations of conventional methods and a novel solution for multi-material bonding*
  Lehmann, C., Singh, D., Gastearena, M., & Comella, L. M. (2025). Surface roughness in microfluidic device fabrication: limitations of conventional methods and a novel solution for multi-material bonding. RSC Advances, 15, 19254-19262. doi: 10.1039/D5RA02701B
• Stretchable printed circuit boards using a silicone substrate of variable stiffness and conventional PCB fabrication methods*
  Jamali, A., Lehmann, C., Aditya, R. T., Goldschmidtboeing, F., Woias, P. & Comella, L. M. (2024). Stretchable printed circuit boards using a silicone substrate of variable stiffness and conventional PCB fabrication methods. Flex. Print. Electron., 9, 045005. doi: 10.1088/2058-8585/ad8242
• Exploiting Stiff PDMS Islands to Enhance Stretchable Printed Circuit Boards*
  Lehmann, C., Jamali, A., Prakash, K. S., Agbozo, S. W., & Comella, L. M. (2024). Exploiting Stiff PDMS Islands to Enhance Stretchable Printed Circuit Boards. 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 1–4. doi: 10.1109/FLEPS61194.2024.10603583